Abstract: Three-dimensional network-on-chip is an important research direction to solve the bottleneck of network- on-chip. 3D network topology makes one of the key problems. In order to solve the problem of rapid increase of node degree and communication bottleneck in high-dimensional hypercube topology, a high-dimensional hypercube fission topology is proposed in this paper. The topology has the advantages of short network diameter and strong scalability under the same network scale. In this paper, the simulation experiment is done with five-dimensional hypercube fission topological structure as an example, and compared with 3D Mesh topology structure analysis: when two topologies both reach saturation under uniform traffic pattern, the throughput of five-dimensional hypercube fission topology upgrades by 300%; the average latency degrades by 85.1%; the average hops decrease by 21.5%. Compared with 3D Mesh, the average latency of five-dimensional hypercube fission topology degrades by 79.1%; the average hops decrease by 13.3% under localized traffic pattern. Simulation results show that the proposed network topology not only retains the advantages of the original hypercube topology, but also solves the communication bottleneck of high-dimensional hypercube topology.

Key words: three-dimensional network-on-chip, hypercube fission, topology, average latency

摘要： 三维片上网络是解决片上网络通讯瓶颈的重要途径，拓扑结构是三维片上网络研究中的关键问题之一。针对高维超立方拓扑结构节点度迅速增加，出现通讯瓶颈的问题，提出一种高维超立方裂变拓扑结构，该拓扑在同等网络规模下具有网络直径短、可扩展性强等优点。以五维超立方裂变拓扑结构为例进行了仿真实验，并与3D Mesh拓扑结构进行了对比分析：当两种拓扑结构在均匀负载状态下达到饱和时，五维超立方裂变拓扑结构的吞吐量比3D Mesh拓扑结构高300%，平均延时比3D Mesh拓扑结构低85.1%，平均跳数比3D Mesh拓扑结构少21.5%；在局部负载下，五维超立方裂变拓扑结构的平均延时比3D Mesh拓扑结构低79.1%，平均跳数比3D Mesh拓扑结构少13.3%。仿真实验表明提出的网络拓扑结构既保留了原有超立方体拓扑结构的优点，又解决了高维超立方体拓扑结构的通讯瓶颈问题。

关键词: 三维片上网络, 超立方体裂变, 拓扑结构, 平均延时