Research on Design Pattern of Electro-thermal Multi-physical Coupling Simulation Software

doi:10.3778/j.issn.1673-9418.1909073

Abstract

Abstract:

The numerical simulation of multi-physical fields like the electric field and the thermal field is a more and more important means of the integrated circuit design in the field of the microelectronics. It involves many kinds of multi-physical fields and analysis, such as electro-thermal fields, electro-thermal-mechanical fields, static analysis, transient analysis and time-harmonic analysis. In order to meet the diverse requirements of the numerical simulation of multi-physical fields and analysis, how to quickly develop a batch of electrothermal multi-physical fields softwares is a challenging problem. Software reuse is the key to solve this problem. This paper presents a software design model that develops software components of mathematical and physical equations. First of all, this paper implements current continuity equation component and steady-state heat balance equation component to solve the reusability problem of single physical field solver. Then, this paper designs the method of multi-physics field calculation process based on free assembling single-physical-field equation components, which supports the custom development of multi-physics coupled field softwares. Moreover, this mode is suitable for parallel computing. Through developing the two customized typical electro-thermal coupled parallel application software, the code reuse rates reach more than 85%, which verifies the validity of the software design model.

Key words: multi-physics field, electro-thermal coupling, software reuse, design pattern, software component

摘要：

电热多物理场耦合数值模拟是微电子领域集成电路设计的重要手段，涉及电-热、电-热-力等多种多物理场耦合，以及静态、瞬态、时谐等多种分析类型。面向这种多样化的多物理场耦合分析需求，如何快速研制批量电热多物理场耦合软件，是一个挑战性问题。软件复用是解决该问题的关键。提出一种数理方程构件化的软件设计模式，首先实现电流连续性方程构件、稳态热平衡方程构件等解决单一物理场求解器的可复用问题，其次设计基于单一物理场方程构件自由组装多物理场耦合计算流程的方法，支持多物理场耦合软件的定制开发，而且这种模式适应于并行计算。通过两个典型的电热耦合并行应用软件的定制开发，代码复用率达到85%以上，验证了模式的有效性。

关键词: 多物理场, 电热耦合, 软件复用, 设计模式, 软件构件

GONG Ping, ZHENG Yuteng, ZHANG Aiqing. Research on Design Pattern of Electro-thermal Multi-physical Coupling Simulation Software[J]. Journal of Frontiers of Computer Science and Technology, 2020, 14(8): 1298-1306.

龚平，郑宇腾，张爱清. 电热多物理耦合模拟的软件设计模式研究[J]. 计算机科学与探索, 2020, 14(8): 1298-1306.

References

[1] Tu K N. Reliability challenges in 3D IC packaging techno-logy[J]. Microelectronics Reliability, 2011, 51(3): 517-523.
[2] Xie J Y, Swaminathan M. Electrical-thermal cosimulation with nonconformal domain decomposition method for multiscale 3-D integrated systems[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2017, 4(4): 588-601.
[3] Corigliano A, Dossi M, Mariani S. Domain decomposition and model order reduction methods applied to the simulation of multi-physics problems in MEMS[J]. Computers & Stru-ctures, 2013, 122: 113-127.
[4] Lu T J, Zhang F N, Jin J M. Multiphysics simulation of 3-D ICs with integrated microchannel cooling[J]. IEEE Transac-tions on Components, Packaging and Manufacturing Tech-nology, 2016, 6: 1620-1629.
[5] Lu T J, Jin J M. Electrical-thermal co-simulation for analysis of high-power RF/microwave components[J]. IEEE Transac-tions on Electromagnetic Compatibility, 2017, 59(1): 93-102.
[6] Shao Y, Peng Z, Lee J F. Thermal analysis of high-power integrated circuits and packages using nonconformal domain decomposition method[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3(8): 1321-1331.
[7] Liu Q K, Mo Z Y, Zhang A Q, et al. JAUMIN: a programming framework for large-scale numerical simulation on unstruc-tured meshes[J]. CCF Transactions on High Performance Com-puting, 2019, 1: 35-48.
[8] Zhu G D. Research on multi-physics and high-efficiency parallel simulation method based on time-domain finite ele-ment method for integrated structure[D]. Hangzhou: Zhejiang University, 2018. 朱国栋. 基于时域有限元的集成结构中多物理高效并行仿真方法研究[D]. 杭州: 浙江大学, 2018.
[9] Song S Y, Li S Q, Zhang Y L. Coupling relation and partition method of multiphysics problem[C]//The 3rd China CAE Engineering Analysis Technology Annual Meeting, Dalian, 2007: 419-425. 宋少云, 李世其, 张永林. 多场问题的耦合关系与分区算法研究[C]//第三届中国CAE工程分析技术年会, 大连, 2007: 419-425.
[10] Tong J. Research on multi-physical effects and high perfor-mance simulation method for advanced integrated packaging[D]. Hangzhou: Zhejiang University, 2018. 童杰. 先进集成封装中多物理效应的高性能仿真方法研究[D]. 杭州: 浙江大学, 2018.
[11] Jin J M. The finite element method in electromagnetics[M]. New York: John Wiley & Sons, 2015.
[12] Wang X C. Basic principle and numerical method of finite element method[M]. Beijing: Tsinghua University Press, 1997. 王勖成. 有限单元法基本原理和数值方法[M]. 北京: 清华大学出版社, 1997.
[13] Hochbruck M, Lubich C. On Krylov subspace approxima-tions to the matrix exponential operator[J]. SIAM Journal on Numerical Analysis, 1997, 34(5): 1911-1925.
[14] Kong F Z, Yin W Y, Mao J F, et al. Electro-thermo-mechanical characterizations of various wire bonding interconnects illumi-nated by an electromagnetic pulse[J]. IEEE Transactions on Advanced Packaging, 2010, 33(3): 729-737.
[15] JAUMIN[EB/OL]. [2019-06-27]. http://www.caep-scns.ac.cn/JAUMIN.php.
[16] Biron F, Billonnet L, Jarry B, et al. Classical and tuneable band-pass filters using MMIC negative resistance circuits for losses compensation and size reduction[C]//Proceedings of the 1999 IEEE Russia Conference on High Power Micro-wave Electronics: Measurements, Identification, Applications, Novosibirsk, Sep 23, 1999. Piscataway: IEEE, 1999: 827822.
[17] Frakes W B, Terry C. Software reuse: metrics and models[J]. ACM Computing Surveys, 1996, 28(2): 415-435.